Chinese language manufacturing large, Huawei, is doing fairly effectively within the trade. As a result of Huawei is a multinational firm, the U.S. ban didn’t have a lot impact on the corporate’s operation. Sure, the ban is crippling its smartphone and pill enterprise, however that’s about all it does. In different regards, Huawei remains to be thriving. That is evident in its newest patents which reveal the corporate’s technological pattern. Not too long ago two Huawei patents hit the general public – one is a scroll machine patent just like historical bamboo slips whereas the opposite is a chip stack packaging patent.

Huawei scroll machine patent

With the emergence of the Oppo X 2021 scrolling display screen idea cellphone final November, cell phone producers have proven nice curiosity in scrolling screens. Xiaomi has beforehand obtained patents associated to scrolling screens, and now Huawei has adopted go well with.

In accordance with the State Mental Property Workplace, on Might 6, Huawei Applied sciences Co., Ltd. has a brand new patent for a “versatile display screen help mechanism and rollable digital tools”. The general design of the patent is similar to historical bamboo slips.

The patent summary exhibits that the machine gives a versatile display screen help mechanism. The rotating meeting can flip over and swap between two states. When the rotating meeting is within the first state, the versatile display screen supporting mechanism can curl. Nonetheless, when the rotating meeting is within the second state, the versatile display screen help mechanism can not curl. The patent software has a easy construction, small space for storing, and also can apply to moveable tools.

At current, Huawei has made two foldable smartphones with internal folding and outer folding mechanisms. This time, Huawei is exploring new methods of folding versatile screens. Whether or not or not Huawei will launch a scrollable display screen smartphone stays below wraps.

Nonetheless, it is very important word that that is solely a patent and there’s no assurance that the machine will truly arrive in the marketplace. Like most patents, it’s doable that this one is not going to see the sunshine of day.

Huawei chip stack packaging patent

Similar to the primary patent, the State Mental Property Workplace additionally introduced a Huawei patent on “chip stack packaging construction, packaging methodology and digital tools”, which additional disclosed Huawei’s stacked chip know-how. The patent comes with software publication quantity CN114450786A. The appliance for this patent dates again to as early as October 30, 2019. The inventors are Zhang Tonglong, Zhang Xiaodong, Guan Yong, and Wang Simin.

This patent describes a chip stacking packaging construction, a packaging methodology, and an digital machine. It pertains to the sector of digital know-how that solves the issue of learn how to reliably bond a number of sub-chip stacking models to the identical major chip stacking unit.

Chip stack bundle construction

The chip stack bundle construction contains

1. A major chip stacking unit (10), having a plurality of major pins (11) which are insulated and spaced on a primary floor;

2. The primary bonding layer (20) is organized on the primary floor; the primary bonding layer (20) includes a plurality of bonding parts (21) that are insulated and organized at intervals;

3. Every of the plurality of bonding parts (21) contains not less than one bonding portion (211), any two bonding parts (211) are supplied in isolation, and the cross-sectional space of ​​any two bonding parts (211) is similar;

4. A plurality of bonding assemblies (21) are respectively bonded with a plurality of major pins (11);

5. A plurality of secondary chip stacking models (30), organized on a floor of the primary bonding layer (20) on a aspect away from the primary chip stacking unit (10);

6. The secondary chip stacking unit (30) has a plurality of micro-bumps (31) which are insulated and organized at intervals;

7. Every of the plurality of micro-bumps (31) bounds to one of many plurality of bonding parts (21).

Again in April, a report from Huawei exhibits a patent for chip stack packaging and terminal tools. The appliance publication quantity is CN114287057A and it entails the sector of semiconductor know-how. It may remedy the issue of excessive price because of the usage of through-silicon by way of know-how whereas making certain the ability supply-demand.

On the press convention of Huawei’s 2021 annual report on the finish of March, Guo Ping, Huawei’s rotating chairman, mentioned that within the future, Huawei might undertake a multi-core construction chip design scheme to enhance chip efficiency. On the similar time, use space for efficiency and stack for efficiency. This methodology allows much less superior know-how to proceed to make Huawei aggressive in future merchandise.